Gigabyte H262-NO0 3rd Gen Intel Xeon Scalable 2U 4-Node DP 24-Bay Gen4 NVMe/SATA/SAS HCI Server

Descripción Corta:

Product Description: Motherboard: MH62-HD1
CPU:
-3rd Generation Intel Xeon Scalable Processors
-Dual processor per node, 10nm technology
-CPU TDP up to 270W
-NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket:
-Per Node: 2 x LGA 4189
-Total: 8 x LGA 4189; Socket P+
Chipset: Intel C621A Chipset
Memory:
-Per node: 16 x DIMM slots
-Total: 64 x DIMM slots
-DDR4 memory supported only
-8-channel memory architecture
-RDIMM modules up to 128GB supported
-LRDIMM modules up to 128GB supported
-3DS RDIMM/LRDIMM modules up to 256GB supported
-1.2V modules: 3200/2933/2666 MHz
LAN:
-Per node:
-2 x 10GbE BASE-T LAN ports (1 x Intel X710-AT2)
-Support NCSI function
-1 x Dedicated management port
Total:
-8 x 10GbE BASE-T LAN ports (4 x Intel X710-AT2)
-Support NCSI function
-4 x Dedicated management ports
-1 x CMC port
Video:
-Integrated in Aspeed AST2600
-2D Video Graphic Adapter with PCIe bus interface
-1920×1200@60Hz 32bpp, DDR4 SDRAM
-Management chip on CMC board: Integrated in Aspeed AST2520A2-GP
Storage:
-Per node: 6 x 2.5″ Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1
-Total: 24 x 2.5″ Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1
-SAS card is required for SAS devices support
SAS: Depends on SAS add-on card
RAID: Intel SATA RAID 0/1/5/10
Expansion Slots:
-Per node:
-Riser Card CRSH01D: 1 x PCIe x16 (Gen4 x16) low-profile slot
-Riser Card CRSH01E:
-1 x PCIe x16 (Gen4 x16) low-profile slot
-1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth
-Total:
-Riser Card CRSH01D x 4:
-4 x PCIe x16 (Gen4 x16) low-profile slots
-Riser Card CRSH01E x 4:
-4 x PCIe x16 (Gen4 x16) low-profile slots
-4 x OCP 2.0 mezzanine slots with PCIe Gen3 x8 bandwidth
-OCP 2.0 bandwidth is shared with onboard LAN. Onboard LAN would be disabled if OCP 2.0 utilizes Gen3 x16 bandwidth
Internal I/O:
-Per node:
-1 x COM header
-1 x SATA 7-pin connectors
-1 x TPM header
-1 x VROC connector
-1 x BMC SGPIO header
-1 x JTAG BMC header
-1 x PLD header
-1 x Clear CMOS jumper
-1 x IPMB connector
Front I/O:
-Per node:
-1 x Power button with LED
-1 x ID button with LED
-1 x Status LED
-1 x Reset button
-Total:
-4 x Power button with LED
-4 x ID button with LED
-4 x Status LED
-4 x Reset button
-1 x CMC Status LED
-1 x CMC Reset button
-Only one CMC Status LED and Reset button per system
Rear I/O
-Per node:
-2 x USB 3.0
-1 x VGA
-2 x RJ45
-1 x MLAN
-1 x ID LED
-Total:
-8 x USB 3.0
-4 x VGA
-8 x RJ45
-4 x MLAN
-4 x ID LEDs
-1 x CMC port
-Only one CMC port per system
Backplane Board:
-Speed and bandwidth:
-PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM:
-1 x TPM header with SPI interface
-Optional TPM2.0 kit: CTM010
Power Supply:
-Dual 2200W 80 PLUS Platinum redundant power supply
-AC Input:
-100-127V~/ 14A, 47-63Hz
-200-240V~/ 12.6A, 47-63Hz
-DC Input:
-240Vdc/ 12.6A
-DC Output:
-Max 1200W/ 100-127V~+ 12.12V/ 95.6A + 12Vsb/ 3.5A
-Max 2200W/ 200-240V~+ 12.12V/ 178.1A + 12Vsb/ 3.5A
-NOTE: The system power supply requires C19 power cord
System Management:
-Aspeed AST2600 management controller
-GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
-Dashboard
-HTML5 KVM
-Sensor Monitor (Voltage, RPM, Temperature, CPU Status ?etc.)
-Sensor Reading History Data
-FRU Information
-SEL Log in Linear Storage / Circular Storage Policy
-Hardware Inventory
-Fan Profile
-System Firewall
-Power Consumption
-Power Control
-Advanced power capping
-LDAP/AD/RADIUS Support
-Backup & Restore Configuration
-Remote BIOS/BMC/CPLD Update
-Event Log Filter
-User Management
-Media Redirection Settings
-PAM Order Settings
-SSL Settings
-SMTP Settings
OS Compatibility:
-Windows Server 2016
-Windows Server 2019
-Windows Server 2022
-Red Hat Enterprise Linux 7.9 (x64) or later
-Red Hat Enterprise Linux 8.2 (x64) or later
-Red Hat Enterprise Linux 9.0 (x64) or later
-SUSE Linux Enterprise Server 12 SP5 (x64) or later
-SUSE Linux Enterprise Server 15 SP2 (x64) or later
-Ubuntu 20.04 LTS (x64) or later
-Ubuntu 22.04 LTS (x64) or later
-VMware ESXi 6.7 Update3 P03 or later
-VMware ESXi 7.0 Update2 or later
-VMware ESXi 8.0 or later
-Citrix Hypervisor 8.2.0 or later
System Fans: 8 x 80x80x38mm (16,300rpm)
Operating Properties:
-Operating temperature: 10C to 30C
-Operating humidity: 8-80% (non-condensing)
-Non-operating temperature: -40C to 60C
-Non-operating humidity: 20%-95% (non-condensing)
-Please leave one PCIe slot empty if using processor with 270W TDP
Packaging Dimensions: 1180 x 779 x 300 mm
Packaging Content:
-1 x H262-NO0
-8 x CPU heatsinks
-1 x 3-Section Rail kit
Part Numbers:
-Barebone package: 6NH262NO0MR-00-1
-Motherboard: 9MH62HD1NR-00
-3-Section Rail kit: 25HB2-A66122-K0R
-CPU heatsink: 25ST1-453212-M1R/25ST1-453213-M1R
-Backplane board -CBPH7O0: 9CBPH7O0NR-00
-Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
-Power Supply: 25EP0-222003-D0S
Optional parts:
-VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
-C19 power cord 125V/15A (US): 25CP1-018000-Q0R
-C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
-M.2 expansion card -CMTP16Z: 9CMTP16ZNR-00
-Ring topology kit: 6NH262Z65SR-00-100
-RMA packaging: 6NH262NO0SR-RMA-A100
Dimensions (WxHxD, mm):
-2U 4-Node -Rear access
-440 x 87.5 x 840